Ceramic bonded diamond wheel has high strength, good heat resistance, sharp cutting, high grinding efficiency, not easy to heat and block during grinding, and small thermal expansion to control machining accuracy. Compared with resin bonded grinding wheel, it solves the problems of low service life of resin bonded diamond grinding wheel, low grinding efficiency and the variability of the grinding tool itself in the grinding process. Ceramic grinding wheel combined with diamond grinding wheel is widely used in the machining of high hard and brittle materials, such as wafer (semiconductor silicon wafer and solar silicon wafer), diamond composite, diamond polycrystalline, diamond cutting tool, cubic boron nitride, tungsten steel (hard alloy), new engineering structural ceramics, gemstones, crystals, rare earth materials (magnetic materials), and has achieved good economic benefits.
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Ceramic bonded diamond wheel has high strength, good heat resistance, sharp cutting, high grinding efficiency, not easy to heat and block during grinding, and small thermal expansion to control machining accuracy. Compared with resin bonded grinding wheel, it solves the problems of low service life of resin bonded diamond grinding wheel, low grinding efficiency and the variability of the grinding tool itself in the grinding process. Ceramic grinding wheel combined with diamond grinding wheel is widely used in the machining of high hard and brittle materials, such as wafer (semiconductor silicon wafer and solar silicon wafer), diamond composite, diamond polycrystalline, diamond cutting tool, cubic boron nitride, tungsten steel (hard alloy), new engineering structural ceramics, gemstones, crystals, rare earth materials (magnetic materials), and has achieved good economic benefits.
1.high durability and good shape retention: its durability is 2-3 times that of other grinding wheels under the same grinding conditions. The grinding wheel has strong abrasive binding force, uniform and stable wear, and the shape of the grinding wheel is not easy to change.
2.good sharpness: its grinding efficiency is about twice that of other super-hard grinding wheels.
3.good dressing ability: it has the same dressing ability as common ceramic corundum and silicon carbide grinding wheel.
4.the particle size for super-finishing is 0-5 μ M grinding wheel has advantages.
5.compared with other super-hard grinding wheels, the comprehensive grinding cost can be reduced by 20%-30%.
1. machining of super-hard tool materials, plane end grinding, cylindrical and chamfer grinding of cemented carbide blades, diamond composite (PCD) and cubic boron nitride composite (PCBN).
2. grinding of cemented carbide molds and parts.
3. fine grinding of the cutting edge of super-hard tools.
4. semiconductor silicon wafer, solar silicon wafer, diamond composite wafer.
5. hard alloy, tungsten steel products.
This product can be customized in many different sizes, contact us first.
